|
|
 |
PCB Capability
| Features |
PCB Batch Production |
PCB Sample Production |
FPC Production |
| Structure |
|
|
|
| Layer Count |
2-28 |
2-32 |
1----12 |
| Board thickness(Min) |
8mil |
4mil |
3mil |
| Board thickness(Max) |
150mil |
200mil |
120mil |
| Board Material |
FR-4,CEM-3, high-TG , Aluminum base, Ro4002,Ro4003 F4, BT |
PTFE，PPO ，PPE |
PI PET PEN |
| Maximum Size |
400mm X 500mm |
500mm X 800mm |
|
| Copper Foil |
|
|
|
| Copper foil outer layer |
1/2OZ-2OZ |
1/2OZ-5OZ |
|
| Copper foil inner layer |
1/2OZ-2OZ |
1/2OZ-5OZ |
|
| Drill |
|
|
|
| Drill hole Bit |
0.2mm--6.00mm |
0.15mm--0.25mm |
0.1mm-6.0mm |
| (mechanical hole) |
| Plating Hole tolerance |
+/- 3mil |
+/- 3mil |
0.025mm |
| Non-Plating Hole tolerance |
+/-2mil |
+/-2mil |
0.05mm |
| Laser hole size |
0.10mm |
0.1mm |
0.1mm |
| Solder Mask |
|
|
|
| Solder Mask Dam(Min) |
2.5mil |
2mil |
2mil |
| Solder Mask Opening(Min) |
2.5mil |
2mil |
2mil |
| Solder Mask plug hole size |
0.25-0.7mm |
0.2-0.7mm |
|
| Solder Mask Color |
green, yellow, black, MATT, blue, red ink,and peelable blue glue. |
| Dilelectric Thickness |
|
|
|
| Core thickness(Min) |
4mil |
4mil |
12um,18um,35um,70um |
| Dielectric thickness(prepreg) |
2mil |
2mil |
|
| Registration Capability |
|
|
|
| Layer to layer |
3mil |
2mil |
|
| Electrical /RF Capability |
|
|
|
| Min Line Width/space (Inner1/2OZ) |
3mil / 3mil |
2.5mil / 2.5mil |
≥0.065mm(1/2oz)≥0.05mm(1/3oz) |
| Min Line Width/space (Inner1OZ) |
4mil / 4mil |
2.5mil / 2.5mil |
|
| Min Line Width/space (outer1/2OZ) |
3mil / 3mil |
2.5mil / 2.5mil |
|
| Line Margin |
0.2 mm（CNC） ：0.30 mm (punch)：0.50 mm (V-CUT) |
0.2 mm（CNC） ：0.30 mm (punch)：0.50 mm (V-CUT |
|
| Impedence |
|
|
|
| ±10% (impedance>50ohm) |
±5% (impedance>50ohm) |
±10% (impedance>50ohm) |
|
| ±5ohm(impedance<50ohm) |
±5ohm(impedance<50ohm) |
|
| Outline |
|
|
|
| Routing Tolerance |
+/- 3mil |
+/- 2.5mil |
|
| Punching tolerance |
+/- 4mil |
+/- 3mil |
|
| V-CUT angle |
30degree, 45degree,60degree, |
30degree, 45degree,60degree |
|
| V-CUT angle tolerance |
+/-3 degree |
+/-3 degree |
|
| V-CUT Deepness Tolerance |
+/- 0.15 mm (V-CUT) ：+/- 0.1 mm (CNC V-CUT) |
| Surface Finish |
|
|
|
| Surface finish |
Lead Free HAL, Organic Solderability Preservative,Electroless Nickel/Immersion gold, Immersion Tin, Immersion Silver |
| E-TEST |
|
|
|
| Test Voltage |
25V-250V |
25V-250V |
|
| Insolation resistance |
5M ohms - 100M ohms |
5M ohms - 100M ohms |
|
| Continuity resistance |
5 ohms - 1k ohms |
50 ohms - 1k ohms |
|
| UL ,ROHS |
YES |
YES |
YES |
PCB Lead Time
Here lead-time for production is mainly based on the board layers ,and for the board with the common spcification subject to both final confirmation .
| Layers |
PCB batch production |
PCB sample production |
| 2 |
3-5 working-days |
24 hours |
| 4 |
5-8working-days |
3 working-days |
| 6 |
9-11working-days |
8-10 working-days |
| 8 |
12-14working-days |
11-12working-days |
| 10 |
14-16working-days |
13-14 working-days |
| 12 |
17-19 working-days |
15-17 working-days |
| 14 |
20-22 working-days |
18-20 working-days |
| 16 |
23-25working-days |
21-23 working-days |
| 18 |
26-28 working-days |
24-25working-days |
|
